*HEADING
 Circuit board drop test -- 1.0 meter drop
 SI units (kg, m, s, N)
*SYSTEM
 0., 0., 0., 0.5, 0.707, 0.25
 -0.5, 0.707, -0.5
*NODE
 1,     0.005, -0.010, 0.012
 11,    0.005, -0.010, 0.162
 501,   0.105, -0.010, 0.012
 511,   0.105, -0.010, 0.162
 1001,  0.,     0.,    0.
 1004,  0.,    -0.009, 0.
 1005,  0.,    -0.011, 0.
 1008,  0.,    -0.02,  0.
 1061,  0.,     0.,    0.024
 1064,  0.,    -0.009, 0.024
 1065,  0.,    -0.011, 0.024
 1068,  0.,    -0.02,  0.024
 16001, 0.110,  0.,    0.
 16004, 0.110, -0.009, 0.
 16005, 0.110, -0.011, 0.
 16008, 0.110, -0.02,  0.
 16061, 0.110,  0.,    0.024
 16064, 0.110, -0.009, 0.024
 16065, 0.110, -0.011, 0.024
 16068, 0.110, -0.02,  0.024
*NGEN, NSET=BOARDA
 1,501,50
*NGEN, NSET=BOARDB
 11,511,50
*NFILL,NSET=BOARD
 BOARDA, BOARDB, 10, 1
**
*NGEN, NSET=PACKAA
 1001,1004,1
 1005,1008,1
*NGEN, NSET=PACKAB
 1061,1064,1
 1065,1068,1
*NFILL,NSET=PACKA
 PACKAA,PACKAB,6,10
*NGEN, NSET=PACKBA
 16001,16008,1
*NGEN, NSET=PACKBB
 16061,16068,1
*NFILL,NSET=PACKB
 PACKBA,PACKBB,6,10
*NFILL,NSET=PACK
 PACKA,PACKB,15,1000
**
** Reset coordinate system
*SYSTEM
*NODE
 50000, -0.10, -0.10, -0.0001
 50001, -0.10,  0.10, -0.0001
 50002,  0.15,  0.10, -0.0001
 50003,  0.15, -0.10, -0.0001
 99999,  0.,    0.,   -0.001
**
** Element definitions
*ELEMENT,TYPE=S4R,ELSET=BOARD
 1,1,51,52,2
*ELGEN,ELSET=BOARD
 1,10,50,1,10,1,10
*ELEMENT,TYPE=C3D8R,ELSET=PACK
 500, 1001,1002,2002,2001, 1011,1012,2012,2011
 530, 1031,1032,2032,2031, 1041,1042,2042,2041
 534, 1035,1036,2036,2035, 1045,1046,2046,2045
*ELGEN,ELSET=PACK
 500, 7,1,1, 3,10,10, 15,1000,100
 530, 3,1,1, 3,10,10, 15,1000,100
 534, 3,1,1, 3,10,10, 15,1000,100
*ELEMENT,TYPE=MASS,ELSET=CHIPS
 6001, 60
 6002, 357
 6003, 403
*ELEMENT,TYPE=R3D4,ELSET=FLOOR
 50000, 50000, 50003, 50002, 50001
**
** Section properties
*SOLID SECTION,ELSET=PACK,MATERIAL=FOAM, CONTROLS=HGLASS
*SECTION CONTROLS, NAME=HGLASS, HOURGLASS=ENHANCED
*SHELL SECTION,ELSET=BOARD,MATERIAL=PCB,ORIENTATION=OR1
 0.002,
*ORIENTATION,NAME=OR1,SYSTEM=RECTANGULAR,DEFINITION=COORDINATES
 0.5, 0.707, 0.25, -0.5, 0.707, -0.5
 2, 90.0
*MASS,ELSET=CHIPS
 0.005,
*RIGID BODY,ELSET=FLOOR,REFNODE=99999
*NSET,NSET=REF
 99999,
**
** Materials
*MATERIAL,NAME=PCB
*ELASTIC
 45.E9, 0.3
*DENSITY
 500.,
*MATERIAL,NAME=FOAM
*ELASTIC
 3.0E6,0.0
*CRUSHABLE FOAM,HARDENING=VOLUMETRIC
 1.1, 0.1
*CRUSHABLE FOAM HARDENING
 0.22000E6, 0.0 
 0.24651E6, 0.1 
 0.27294E6, 0.2 
 0.29902E6, 0.3 
 0.32455E6, 0.4 
 0.34935E6, 0.5 
 0.37326E6, 0.6 
 0.39617E6, 0.7 
 0.41801E6, 0.8 
 0.43872E6, 0.9 
 0.45827E6, 1.0 
 0.49384E6, 1.2 
 0.52484E6, 1.4 
 0.55153E6, 1.6 
 0.57431E6, 1.8 
 0.59359E6, 2.0 
 0.62936E6, 2.5 
 0.65199E6, 3.0 
 0.68334E6, 5.0 
 0.68833E6, 10.0
*DENSITY
 100.,
**
** Element Faces for Contact
*ELSET,GENERATE,ELSET=LOWBOARD
 1,10,1
**
** Define output locations and variables
*NSET,NSET=CHIPS
60,357,403
*NSET,NSET=QA_TEST_NSET
BOARD,
*ELSET,ELSET=BOTPART
 18,
*ELSET,ELSET=PARTS
 18,57,81
**
*BOUNDARY
 REF,ENCASTRE
*INITIAL CONDITIONS,TYPE=VELOCITY
 BOARD, 3, -4.43
 PACK,  3, -4.43
**
*SURFACE INTERACTION,NAME=FRIC
*FRICTION
 0.3,
*CONTACT
*CONTACT INCLUSIONS, ALL ELEMENT BASED
*CONTACT PROPERTY ASSIGNMENT
 ,  , FRIC
**
*STEP
*DYNAMIC,EXPLICIT
 ,0.02
*BULK VISCOSITY
 0.06, 1.2
**
*OUTPUT,FIELD,NUMBER INTERVAL=5,TIMEMARKS=YES
*NODE OUTPUT
 U,
*ELEMENT OUTPUT
 1,5
 S, PE,
*OUTPUT,HISTORY,TIME INTERVAL=0.1E-3
*NODE OUTPUT,NSET=CHIPS
 U,A,V
*ELEMENT OUTPUT,ELSET=BOTPART
 1,5
 LEP, SP, S
*ENERGY OUTPUT, VARIABLE=PRESELECT
**
** OUTPUT FOR ABAQUS QA PURPOSES
*FILE OUTPUT,NUMBER INTERVAL=3,TIMEMARKS=YES
*NODE FILE,NSET=CHIPS
 U,
*OUTPUT,FIELD,NUM=1
*NODE OUTPUT,NSET=QA_TEST_NSET
U,
*END STEP